
Director of Hardware Engineering
Broadcom
Full time
Business Management
Canada
Hiring from: Canada
Job Description:
As a Director Hardware Engineer, you will be the technical lead responsible for a design team developing and delivering Ultra High-performance electronic products. In addition to team leadership, Technical leads participate in the process and are expected to own and design critical pieces of a solution. We are looking for candidates who thrive in a fast-paced, start-up-like environment and are proud of delivering high-quality products. You will own all aspects of EE hardware design, including BOM creation, participation with vendor negotiators, circuit/board design, development, and validation of a product range. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining. You will drive a philosophy of small teams of experienced engineers supporting a One Person One Board development culture.
You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. In addition, Joint development programs may require extensive interaction with partner engineering teams at an engineering leadership level.
Key Qualifications & Experience:
As a Director Hardware Engineer, you will be the technical lead responsible for a design team developing and delivering Ultra High-performance electronic products. In addition to team leadership, Technical leads participate in the process and are expected to own and design critical pieces of a solution. We are looking for candidates who thrive in a fast-paced, start-up-like environment and are proud of delivering high-quality products. You will own all aspects of EE hardware design, including BOM creation, participation with vendor negotiators, circuit/board design, development, and validation of a product range. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining. You will drive a philosophy of small teams of experienced engineers supporting a One Person One Board development culture.
You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. In addition, Joint development programs may require extensive interaction with partner engineering teams at an engineering leadership level.
Key Qualifications & Experience:
- Team Lead of High Speed Hardware designers.
- Large high-powered SOCs based on advanced silicon and packaging process technologies, including 2D, 2.5D, and 2.5D with 3D memories.
- Precision Scopes, Analyzers, development & validation tools.
- Power and Thermal issues associated with PCBs with 1kW+ footprints.
- High-speed & High-density signaling with SerDes rates of 112G+.
- Demonstrate lifecycle product ownership of complex products. Participating in a cross-functional team from product inception to volume production.
- Work with support groups, including Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability.
- Bachelor's degree in electrical engineering and 15+ years.
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